Most of the resources used for this lecture refer to Xilinx FPGAs. Device specific drawings are taken from XILINX Advanced FPGA Packaging.

Xilinx PK381 324 Ball Chip-Scale BGA (CSG324) Package, 0.80 mm Pitch, Package Drawing PK381 (v1.1) November 23, www.xilinx.com 1 © Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks o f Xilinx in the United States and other countries.

2004 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at 

Navigating Content by Design Process Xilinx documentation is organized around a Device diagrams showing package pinout (previously separated into I/O 

Download scientific diagram | Bottom View of a XILINX FG1156 – Package Size is 35 x 35 mm with a 34 x 34 Array of Solder Balls of Nominal Diameter of 0.6 mm 

Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the 

Title: Plastic Flip-chip BGA (FF1148) Package Author: Xilinx, Inc. Subject: Plastic Flip-chip BGA (FF1148) Package Keywords: Xilinx, packaging, package, package

Thermal Packaging Management: Application Note XAPP415. 460 KB (v1.0) 12/19/01. Group. Package. Symbol. Package Description.

Where to easily find Package Drawings. I program SMT P&P equipment and use XILINX part almost daily. We get new packages in often. Is there a database to find these are a search

Xilinx TQFP (TQ144/TQG144) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 144-Pin TQFP (TQ144/TQG144) Keywords: tq144, tqg144, 144 pin, TQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

trademarks of Xilinx, Inc. All other trademarks are the property of their respective owners. PK081 (v1.1) December 15, 2008. Fine-Pitch (FG484/FGG484) BGA 

Package Drawings Package drawings are available online at the Package Drawings page on xilinx.com . Specifications and definitions Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

Package drawings are mechanical specifications that include exact dimensions for the placement of pins, height of the package, and related 

2 www.xilinx.com PK012 (v1.2.1) February 26, 2007 VQFP (VQ100/VQG100) Package Revision History The following table shows the revision history for this document. Date Version Revision 6/18/04 1.2 Xilinx Initial Release 2/26/07 1.2.1 Minor update to clarify Note #2.

Has anyone managed to find the VQ100 package drawings > on the Xilinx web site? It doesn't appear to be with > the other package drawings, and a search of the web > site turned up nothing. > > The VQ100 is one of the packages for the Spartan 3. > > Thanks, > Eric You can find the mechanical drawings for the VQ100 package at the following link

Virtex®-7 FPGA Package Files. Spartan®-6 FPGA Package Files. Kintex®-7 FPGA Package Files. Virtex®-5 FPGA Package Files. Artix®-7 FPGA Package Files. Virtex®-4 FPGA